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Solder Ball Attach System (K-2)

Product Detail Information

 

 

 

 

The KOSES Solder Ball Attach System is the ideal solution for small solder ball, Micro ball to ball gap and Fine pitch packages.

Special Function

       Easy set-up; User friendly set-up function, less conversion time

       PCB Shrinkage / Expending Free Solution; KOSES’ own special technologies provide solution for Shrinkage/Expending with 1(one) step ball attach.

       Small ball / Micro Ball to Ball gap / Fine pitch